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4D

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ROLE of THE PRODUCT

Product Role

SMT defects to solve

Open

It occurs when the terminal and solder are not in contact at the solder freezing point.

Crack

Occurrence of stress due to increased warpage and flatness after the solder solidification point.

Bad pillow

Warpage and flatness increase before solder solidification point, causing solder oxidation.

Visualization

Factor

Warp

Visualize the amount of deformation of the board, IC package, and connector housing due to heat.

Flatness

Visualization of the floating amount of IC and connector terminals the board surface.

CONCEPT of THE PRODUCT

Product concept

4D=3D+C

VALUE of THE PRODUCT

Product value

From micro bumps to substrates
Measure with one unit

Ultra-small BGA bump of 50 μm from 200 mm substrateIn addition, it is possible to measure one SMT component with a large variety of types without complicated setting.

Shiny to matte
Without spraying things

How to cut light with high brightness blue laserAdopted. Allows measurement from silicon wafers to molded packages without pretreatment.

Not only the result
Factor analysis

In addition to the flatness of the terminals, the bending of the housing can be analyzed with a realistic 3D video,Analysis of causal relationship between terminal flatness and housing warpageIs possible.

Not just heating
In reflow environment

Instead of heating on one side with a hot plate or halogen heater, use the same hot air as the reflow furnace Convection heating To reproduce the reflow environment.

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Product review information

Available online

cores Lab is, CORES is a lab where you can experience the products.

Please feel free to contact us as we can carry out our own sample evaluation or send it online for remote evaluation.